Adrian JohnsonTLDR:
The U.S. and European Union highlighted the importance of collaboration in critical and emerging technologies during the Trade and Technology Council (TTC) meeting in Washington, D.C. Both parties discussed the need to counter technology misuse, establish resilient supply chains, and promote innovation in areas such as artificial intelligence (AI) and cybersecurity. Strategies for enhancing supply chain resilience and investment in semiconductor manufacturing were also explored. The signing of the U.S.-EU Joint CyberSafe Products Action Plan and plans for a follow-up TTC meeting in 2024 were seen as positive steps towards transatlantic cooperation. The author argues that the TTC should continue as a forum for addressing trade and technology challenges, advocating for the establishment of a permanent secretariat and a strong public narrative to promote the TTC’s benefits. The future of the TTC remains uncertain, but there is a strong case for its continued existence and strengthening.
Key Points:
- The U.S. and EU emphasized the importance of collaboration in critical and emerging technologies during the TTC meeting.
- Discussions focused on countering technology misuse, establishing resilient supply chains, and promoting innovation in areas such as AI and cybersecurity.
- The signing of the U.S.-EU Joint CyberSafe Products Action Plan and plans for a follow-up TTC meeting in 2024 were seen as positive steps towards transatlantic cooperation.
- The author argues that the TTC should continue as a forum for addressing trade and technology challenges.
- They advocate for the establishment of a permanent secretariat and a strong public narrative to promote the TTC’s benefits.
The U.S. and European Union highlighted the importance of collaboration in critical and emerging technologies during the Trade and Technology Council (TTC) meeting in Washington, D.C. Both parties discussed the need to counter technology misuse, establish resilient supply chains, and promote innovation in areas such as artificial intelligence (AI) and cybersecurity. Strategies for enhancing supply chain resilience and investment in semiconductor manufacturing were also explored. The signing of the U.S.-EU Joint CyberSafe Products Action Plan and plans for a follow-up TTC meeting in 2024 were seen as positive steps towards transatlantic cooperation. The author argues that the TTC should continue as a forum for addressing trade and technology challenges, advocating for the establishment of a permanent secretariat and a strong public narrative to promote the TTC’s benefits. The future of the TTC remains uncertain, but there is a strong case for its continued existence and strengthening.